Overview / Main Features
The HP t5740 is a thin client box powered by an Intel Atom N280 CPU running along side a non-standard Intel GL40 graphics and memory controller (Northbridge) with an Intel 82801IBM I/O controller (Southbridge). The t5740 also features 1GB of RAM memory (Samsung SO-DIMM) and a SSD drive from Apacer which interestingly enough is spec'ed as a PATA drive and therefore necessitating an additional SATA to PATA bridge IC from JMicron Tech.
Pricing - According to HP's website, the t5740 in this configuration cost $429
Availability - assumed global
For the purposes of this teardown analysis, we have assumed a lifetime production volume of 1.2M units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Main Cost Drivers Representing ~80% of total materials cost
Intel - AU80586GF028D - CPU - Intel Atom Processor N280, 1.66GHz, 512KB L2 Cache, 667MHz FSB, 45nm Process
Samsung Semiconductor - M471B2873EH1-CH9 - SO-DIMM DDR3-1333 - 1GB, 128Mx64, 1.5V
Apacer - SSD Module Value Line Item - 2GB, SLC NAND, PATA
Intel - AC82GL40SLGGM - Northbridge - Graphics and Memory Controller Hub
HannStar Board Corp. - 6-Layer - FR4, Lead-Free
Intel - AF82801IBMSLB8Q - Southbridge - I/O Controller Hub (ICH9M)
Cooler Assembly - Die-Cast Aluminum Plate, Copper Heat Tube and Copper Plate & Machined Aluminum Fins, w/ Thermal Transfer Material & 4 Spring-Loaded Mounting Screws & 4 Lock Washer
Enclosure / Cage - Stamped / Formed Electro-Galvanized Steel, w/ 4-Piece Metal Tap & 14 Integral Metal Joints & 4 Pressed-In Threaded Metal Stand Off
Enclosure, Main, Left - Injection Molded Flame Retardant ABS-Polycarbonate, Painted, Recyclable
Enclosure, Main, Right - Injection Molded Flame Retardant ABS-Polycarbonate, Painted, Recyclable
Enclosure / Cage Cover - Stamped / Formed Electro-Galvanized Steel, w/ 4 Pressed-In Threaded Metal Stand Off
SMSC - SCH5407-NW - I/O Controller - Super I/O Device
Total BOM Cost $139.66
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
Country of Origin / Volume Assumptions
Based on markings, the unit was likely assembled in China.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as connectors), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The HP t5740 has an overall component count of 980, of which, 926 reside on the main PCB.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for the China.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.