Acquired Electronics360

Wireless Connectivity

Qualcomm UNDP-1H (HP Mobile) Broadband Module Teardown

30 January 2009
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Overview / Main Features

The Qualcomm UNDP-1H is a mobile broadband modem module featuring Qualcomm's new Gobi (MDM1000) broadband chipset with support for both HSPA and EV-DO 3G wireless data standards - a first for this product category. The mini PCIe module was specifically developed for HP mobile computers (according to FCC records) and features dual band EV-DO/1xRTT radios along with tri-band HSPA and the obligatory quad band EDGE/GPRS radios.

Qualcomm UNDP-1H (HP Mobile) Broadband Module Main ImageQualcomm UNDP-1H (HP Mobile) Broadband Module Main Image

Target Market

Wireless Data service providers / Wireless data consumers (primarily business professionals)

Released

Per FCC documentation, first released for use in select HP mobile computers on October 2008.

Qualcomm UNDP-1H (HP Mobile) Broadband Module - Main PCB TopQualcomm UNDP-1H (HP Mobile) Broadband Module - Main PCB Top

Pricing and Availability

Pricing - Typically, mobile broadband modules are heavily subsided by the service provides. However, it is not uncommon to see embedded 3G modems selling for upwards of $150 as an option offered by the laptop manufacturers.

Availability - assumed global

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 4M units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Market / Sector Performance

According to a topical paper on WWAN modems titled "Mobile Broadband Shifts into High Gear with USB Modems, iSuppli estimates 13.8 million WWAN modems were shipped in 2007, growing at a CAGR of nearly 50% to reach 103.22 million shipments by 2012. These estimates include those modems shipped as PCMCIA cards, USB dongles (as in this case) or embedded modules.

The report also cites six major modem suppliers of WWAN connectivity for mobile PCs: Huawei, Sierra Wireless, Novatel, Option, Ericsson and Qualcomm. The latter 2 manufacturers are relative new-comers to the WWAN module market space.

Qualcomm UNDP-1H (HP Mobile) Broadband Module Cost AnalysisQualcomm UNDP-1H (HP Mobile) Broadband Module Cost Analysis

Cost Notes

Main Cost Drivers Representing ~83% of total materials cost

Qualcomm - MDM1000 - Baseband - Single Chip, CDMA2000 1x EV-DO, UMTS, HSPA, w/ GPS

Qualcomm - RTR6285 - RF Transceiver - ZIF, Quad-Band GSM/EDGE & Tri-Band UMTS 800/1900/2100MHz Transceiver, GPS Receiver, Support Receive Diversity

Qualcomm - RFR6500 - RF Receiver - ZIF, Dual-Band WCDMA 850/1900MHz, GPS

Qualcomm - PM6653 - Power Management IC

Triquint Semiconductor - TQM7M5008 - PAM - Quad-Band GSM/EDGE

Wus Printed Circuit - 10-Layer - FR4/RCF HDI, 2+6+2

Numonyx - M58WR032KB70ZB6 - Flash - NOR, 32Mb (2Mb x 16 Multi Banks, Burst Mode), Bottom Boot, 1.8V, 70ns

VCO

Total BOM Cost $47.88

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

OEM/ODM/EMS Relationships / Manufacturing

According to label on device, the Qualcomm broadband module was manufactured by Hon Hai (otherwise known as Foxconn).

Country of Origin / Volume Assumptions

Based on markings, the unit was assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc. were also sourced in China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as RF shields), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Design for Manufacturing / Device Complexity

The total component count for the Qualcomm UNDP-1H mobile broadband module is 453. This level of component complexity places the UNDP-1H within the norms of similar HSPA broadband modems and about half as much as one would expect to see in a mobile handset.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Qualcomm UNDP-1H (HP Mobile) Broadband Module - Main PCB BottomQualcomm UNDP-1H (HP Mobile) Broadband Module - Main PCB Bottom

Design Notes

The core of the Qualcomm design is the MDM1000 Gobi chipset which includes the MDM1000 chip itself along with a secondary baseband IC and a Samsung 256Mb Mobile DDR memory. The UNDP-1H also has a dual Qualcomm RF Transceiver solution featuring both a RTR 6285 and aRFR6500 for the both operational modes. A Qualcomm PM6653 IC is implemented to manage power consumption.

The PA section features 4 power amps: 3 discrete band (850, 1900 & 2100MHz) from Anadigics for both HSPA and EV-DO/1xRTT modes and 1 Triquint Semiconductor quad-band GSM/GPRS/EDGE.

The memory section features a Numonyx 32Mb NOR flash.

Here is a summary of the major components used in the Qualcomm UNDP-1H design:

Main PCB

Baseband

  • Baseband - Qualcomm - MDM1000

Power Management

  • Power Management IC - Qualcomm - PM6653

RF Transceiver

  • RF Transceiver - Qualcomm - RTR6285
  • RF Receiver - Qualcomm - RFR6500

Memory

  • Flash - Numonyx - M58WR032KB70ZB6

Power Amplifier

  • PAM - Triquint Semiconductor - TQM7M5008
  • PAM - Anadigics - AWT6279RM20P (WCDMA/HSPA 2100, 1950MHz)
  • PAM - Anadigics - AWT6278RM20P (WCDMA/HSPA 1900, 1880MHz)
  • PAM - Anadigics - AWT6273RM20P (WCDMA 850, 836.5MHz)


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