Acquired Electronics360

Information Technology

HP ProLiant DL385 G7 Server Motherboard Teardown

18 November 2010
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Overview

The HP DL385 server motherboard under analysis here represents the main PCB from the HP ProLiant DL385 G7 server featuring an AMD SR5690 / SR5100 Chipset.

HP ProLiant DL385 G7 Server Motherboard Main ImageHP ProLiant DL385 G7 Server Motherboard Main Image

Volume Estimations

For the purposes of this analysis, product lifetime volume is presumed to be 400K units.

As a reminder, volume production assumptions are meant primarily to be used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially), and not necessarily as a market accurate estimate for a specific model. Our estimations are based on iSuppli market research and we derive rational estimates based on overall market shares of the manufacturer in question, as well as the number of products in a given portfolio and the relative popularity of certain lines of products.

HP ProLiant DL385 G7 Server Motherboard Cost AnalysisHP ProLiant DL385 G7 Server Motherboard Cost Analysis

Cost Notes

Main Cost Drivers Representing ~75% of Total Direct materials Costs

Compeq - 16-Layer - FR4

Broadcom - BCM5709CC0KPBG - Ethernet Controller - Dual-Port, 10/100/1000/2500Base-T, Integrated TCP Processing Engine, RDMA, iSCSI (Qty:2)

PMC-Sierra - PM8011C-F3GI - I/O Controller - 8-Port SAS-2/SATA, 1.5G/3G/6G, PCI Express/PCI-X Interface, Integrated Raid-On-Chip Technology, 90nm Process

AMD - 215-0716038 (SR5690) - Northbridge - HyperTransport 3.0, PCI-E Gen 2 (42 Lanes, 11 Engines), 65nm Process

AMD - ES1000 - GPU - 2D, 200MHz Core, 32-Bit 33/66MHz PCI 2.2, 16-Bit 256MB DDR-II SDRAM Support, Dual CRT Support

Lattice Semiconductor - LCMXO2280C-3FTN324C - PLD - 2280 LUT's, 271 I/O's, 7.5Kb RAM, 2 PLL, 1.2/1.8/2.5/3.3V

HP - 438893-502 - Lights-Out Management Processor

Foxconn - CPU Socket Kit - LGA1974, w/ Metal Retainer Assembly & Bottom Mounting Plate

Foxconn - CPU Socket Kit - LGA1974, w/ Metal Retainer Assembly & Bottom Mounting Plate

AMD - 218-0660026 (SP5100) - Southbridge - PCI 2.3 Interface, 6 SATA 2.5 Ports, SATA 3.0 & RAID Support, 12 USB 2.0 Ports, 130nm Process

Foxconn - Memory Socket - DIMM, DDR3 (Qty:12)

Foxconn - Memory Socket - DIMM, DDR3 (Qty:12)

International Rectifier - IR3506MTRPBF - Regulator Phase/Gate Drive IC - 7V/2A Gate Drivers (Qty:6)

International Rectifier - IR3506MTRPBF - Regulator Phase/Gate Drive IC - 7V/2A Gate Drivers (Qty:6)

Foxconn - JFM3811Q-H380-4F - Jack - RJ45, Right Angle, w/ Integrated Magnetics, 2 LEDs & Metal Shielding (Qty:4)

Lattice Semiconductor - LCMXO640C-3FTN256C - PLD - 640 LUT's, 159 I/O's, 6Kb RAM, 1.2/1.8/2.5/3.3V

Maxim - MAX8643AETG+ - Regulator - Step-Down, Sink/Source, 3A, 2MHz, w/ Integrated Switches (Qty:4)

Total BOM Cost $475.21

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

Country of Origin

The HP DL385 server motherboard is assumed to be produced in China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as connectors), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

HP ProLiant DL385 G7 Server Motherboard - PCB TopHP ProLiant DL385 G7 Server Motherboard - PCB Top

Design for Manufacturing / Device Complexity

The total component counts of the HP DL385 server motherboard is 5337 parts.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement