Acquired Electronics360

Mobile Devices

Sharp NTT DoCoMo SH-01A Mobile Phone Teardown

07 January 2009
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Overview / Main Features

The Sharp SH-01A is a high end handset designed for NTT DoCoMo's 3G network commissioned under the "Prime Series line of handsets. The quad band GSM / tri band WCDMA world phone features an Aquos branded 3.3 inch color display, 1-Seg TV tuner and a class leading 8 megapixel CCD camera. Also common within this new breed of NTT DoCoMo feature phones, the SH-01A comes standard with GPS capabilities and RFID functionalities (works FeliCa branded services). The HSDPA enabled handset is data capable up to 7.2Mbps and features a Symbian operating system (with MOAP user interface localized for the Japanese market).

NTT DoCoMo's 3G networks boast some of the fullest featured wireless handset devices for the Japanese market and the Sharp sets new marks and records for device complexity and silicon content. Unlike other (higher volume) handsets designed for European and US markets, the Sharp handset BOM weighs in at a significant premium over comparable high end handsets iSuppli has previously analyzed.

Sharp NTT DoCoMo SH-01A Mobile Phone Main ImageSharp NTT DoCoMo SH-01A Mobile Phone Main Image

Target Market

The NTT DoCoMo Sharp SH-01A is an offering within the ""Prime" series of high end feature handsets. The target demographic is primarily Japanese mobile handset users.

Released

Per press releases, first release in the Japanese Market on Nov. 2008.

Sharp NTT DoCoMo SH-01A Mobile Phone - Main PCB TopSharp NTT DoCoMo SH-01A Mobile Phone - Main PCB Top

Pricing and Availability

Pricing - Mobile handset pricing typically has little bearing on the true market value of the device due to the fact that service carrier invariably use subsidies to incentivize consumers to commit to long term service contracts. However, based on our understanding, the unsubsidized cost of the handset us between 60,000 and 64,000 Yen or $650 to $700 at the time of writing (January 2009).

Availability - As a pseudo-private labeled handset for NTT DoCoMo, the Sharp SH-01A is available exclusive to the carrier and to the Japanese market.

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 850K units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Sharp NTT DoCoMo SH-01A Mobile Phone - Main PCB BottomSharp NTT DoCoMo SH-01A Mobile Phone - Main PCB Bottom

iSuppli's Design Forecast Tool (DFT) and Market Shares

As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design feature and manufacture, as well as the number of design starts a manufacturer will have by feature set.

iSuppli estimates unit shipment of 105 million HSDPA handsets globally for the year of 2008. All estimates are based on the assumption of 2 year life span

Sharp NTT DoCoMo SH-01A Mobile Phone Cost AnalysisSharp NTT DoCoMo SH-01A Mobile Phone Cost Analysis

Cost Notes

Main Cost Drivers Representing ~67% of total materials cost

Renesas - R8J73670BGV - DBB - Digital Baseband Processor

Primary Camera Module Value Line Item - 8.3MP CCD, 1/2.5' Format, Auto Focus Lens

Sharp - Display Module Value Line Item - 3.3' Diagonal, 16.7M Color TFT, 854 x 480 Pixels

Fujitsu - MBG027 - Multimedia Co-Processor

Sharp - VA3A5JZ916 - TV Tuner Module - ISDB-T

LED High Intensity White (Qty:31)

Renesas - ASIC A

Fujitsu - MB39C311A - ABB - Analog Baseband / Power Management, & Audio Interface

Renesas - R2A60281LG - RF Transceiver - GSM/WCDMA Dual-Mode, HSDPA 7.2Mbps, Quad-Band GSM/GPRS/EDGE, Quad-Band WCDMA, 800/1500/1800/2100MHz, 0.18um Bi-CMOS

Analog Devices - ASIC - Multimedia

Sharp Microelectronics - IXA189 - Video / Image Processor

Spansion - S98WS256P0JHW02 - MCP - 256Mb NOR Flash + 256Mb Mobile SDRAM (Estimated)

CMK Corp - 8-Layer - FR4/RCF HDI, 3+2+3, Stacked Via

Battery - Li-Ion, 3.7V, 800mAh

LED High Intensity White (Qty:18)

Murata - Bluetooth Module - V2.0+EDR

Secondary Camera Module Value Line Item -CIF CMOS, 1/10.8' Format, Fixed Lens

Total BOM Costs $305.13

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

OEM/ODM/EMA Relationships / Manufacturing

Although, as part of iSuppli's ""Global OEM Manufacturing and Design Analysis (GOMDA)", we track major OEM and ODM relationships, Sharp represents such a small player on the global scale, we do not track their sales or manufacturing relationships.

It is assumed for the purposes of this analysis, that either Sharp are building these in house, or with a Japan-based EMS provider.

Country of Origin / Volume Assumptions

Based on markings, the unit was assembled in Japan. Furthermore, due to the low assumed production volume, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in Japan.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as display modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Design for Manufacturing / Device Complexity

Japanese mobile handsets are renowned for their intricate designs, high precision and overall build quality. The Sharp SH-01A handset is no exception. By all accounts, the handset - through its inherent design and user interface - exhibit a level of complexity higher than typical 3.5G handsets that the rest of the western world markets are not accustomed to. In fact, the SH-01A sets new records feature handsets with a component count of 1357 parts [besting the similiarly featured Panasonic P-01A]. Typically, this level of complexity is reserved for high-end smartphones or wireless PDAs.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for Japan.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

The Sharp SH-01A is one of the highest IC density handset we have encountered. Despite chemical IC encapsulation and detailed microscopic analysis, many of the private labeled ICs presented challenges when it comes to obtaining product information and specifications. Therefore, in some case, we had to assume the functionality of the major ICs.

Within the SH-01A, the main PCB features a very large DBB chip by Renesas (measuring nearly 1cm squared) and a Fujitsu co-processor. Both of these 2 ICs account for 25% of the overall BOM cost. The other significant designs on the SH-01A are the 8MP CCD based camera module and the 3.3 inch primary color display.

Mechanically, the Sharp features a swivel flip design for both landscape and traditional flip phone operations. The handset also features an optical track pad input device coined the Touch Cruise by Sharp. This operates much as an inverted mouse with a built in fingerprint biometric scanner.

Here is a summary of the major components used in the Sharp SH-01A mobile handset design:

Main PCB

Baseband - Memory

  • DBB - Renesas - R8J73670BGV

ABB / Power Management

  • ABB - Fujitsu - MB39C311A, Analog Baseband / Power Management, & Audio Interface
  • Power Management IC - Rohm - BH6785

User Interface

  • Multimedia Co-Processor - Fujitsu - MBG027
  • Video / Image Processor - Sharp Microelectronics - IXA189
  • ASIC - Analog Devices - Multimedia

RF Transceiver

  • RF Transceiver - Renesas - R2A60281LG

Memory

  • MCP - Spansion - S98WS256P0JHW02

SIM / MicroSD Card PCB

  • TV Tuner Module - Sharp - VA3A5JZ916, ISDB-T

Display

  • Display Module - 3.3' Diagonal, 16.7M Color TFT, 854 x 480 Pixels

Camera

  • Primary Camera Module - 8.3MP CCD, 1/2.5' Format, Auto Focus Lens

Sharp NTT DoCoMo SH-01A Mobile Phone - Enclosure DisassemblySharp NTT DoCoMo SH-01A Mobile Phone - Enclosure Disassembly



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement