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HP P2000 G3 MSA Array System Teardown

04 June 2013
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Summary Points

  • 2U rack server
  • Controller Modules: 1 included (up to 2 supported)
  • CPU/Chipset: Intel EP80579 Integrated Processor
  • 8Gb Fibre Channel
  • 2 x 1GB Mini-DIMM Memory Modules
  • Supports up to 24 HDDs (none included)
  • 573W Switching Power Supply

Target Market

Small to Medium Business

HP P2000 G3 MSA Array System Main ImageHP P2000 G3 MSA Array System Main Image

Released

2010

Based on data sheet copyright date.

Pricing and Availability

~$5680 USD

Found online as low as ~$5680 USD from various online retailers. This price applies to the whole 2U system. Not the exact configuration analyzed.

HP P2000 G3 MSA Array System - Backplane PCB Top and BottomHP P2000 G3 MSA Array System - Backplane PCB Top and Bottom

Worldwide

Assumed

Volume Estimations

150,000 Annual Production Volume
3 Product Lifetime (Years)

For the purposes of this teardown analysis, we have assumed an Annual Production Volume of 150000 units and a Product Lifetime Volume of 3 year(s).

Teardown volume and production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

HP P2000 G3 MSA Array System - Backplane PCB Top and BottomHP P2000 G3 MSA Array System - Backplane PCB Top and Bottom

Cost Notes

Total BOM: $889.81
Top Cost Drivers below: $581.63
% of Total BOM 65%

Main Cost Drivers below

Xilinx XCE05L11T-FFG1136 FPGA - Virtex-5 Series- (Qty: 1)
UMT - Unimicron Technology 16-Layer - FR4, Lead-Free, Halogen-Free- (Qty: 1)
Emerson Network Power 7001540-J000 Switching Power Supply - Redundant, 573W Max, 100-240V/7.2A Input, 12V/40A & 5.1V/30A & 3.36V STBY/0.45A Output- (Qty: 1)
TriCor Technologies AVG7228U61E5667F1-MTHP Mini-DIMM DDR2-667 - 1GB, 1.8V- (Qty: 2)
Intel NU80579EZ009C CPU - Intel EP80579 Integrated Processor, 1.2GHz, 256KB L2 Cache, 90nm- (Qty: 1)
QLogic EP2532 Fibre Channel Controller - Dual-Channel, 8 Gbps, PCI Express- (Qty: 1)
Enclosure, Main, Chassis - 6 Pieces Stamped / Formed Electro-Galvanized Steel, w/ 4 Injection Molded Plastic Rails, 8 Pressed-In Threaded Metal Inserts, 4 Pressed-In Threaded Metal Pins, and 48 Rivets- (Qty: 1)
PMC-Sierra PM8005C-F3EI SAS Expander - 36-Port, 6 Gbps, w/ Secure Zoning Capabilities- (Qty: 1)
LSI Logic LSISAS2008 SAS Controller - RAID on Chip, 8-Port, 6 Gbps, PCI Express 2.0 Interface- (Qty: 1)
Molex 757051634 Backplane Connector - Header, Hard Metric, Vertical, 11 Row x 6 Column- (Qty: 4)

HP P2000 G3 MSA Array System Cost AnalysisHP P2000 G3 MSA Array System Cost Analysis

Not Included in Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

We do provide an Excel tab 'Overall Costs' where a user can enter their known pre and post production costs to build a per unit cost reflective of theirs actual expenditures.

Country of Origin

For the purposes of this analysis, we are assuming the following country(ies) of origin for each level of assembly, based on a combination of 'Made In' markings, and/or assumptions based on our knowledge of such equipment.

Backplane PCB - China
Midplane PCB - China
Misc Interface PCBs - China
Motherboard - China
Other - Enclosures / Final Assembly - Singapore

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as TBD), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Design Complexity

Component counts by assembly and the number of assembly are indicators of design complexity and efficiency.

Component Qty: 2299 - Motherboard
Component Qty: 71 - Other - Enclosures / Final Assembly
Component Qty: 595 - Backplane PCB
Component Qty: 63 - Midplane PCB
Component Qty: 44 - Misc Interface PCBs
Component Qty: 3072 - Grand Total

HP P2000 G3 MSA Array System - Disassembly View 1HP P2000 G3 MSA Array System - Disassembly View 1



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