Overview / Main Features
The Sony Ericsson Xperia X10 marks the first Android based smartphone for the handset brand after the first 2 Xperia models (X1 and X2) which were based on Windows platform. The tri-band UMTS/ quad-band GSM handset comes equipped with a 4 inch touchscreen display and 8MP camera. Internally, the X10 features a 1GHz Snapdragon baseband processor from Qualcomm - QSD8250 - same one as we have see previously on the Toshiba TG01, Google Nexus One and HTC Touch HD2. On the software front, the X10 runs version 1.6 of Google Android with a custom SonyEricsson UI overlay called "Timescape and ""Mediascape".
Per press release, first release H2 2010.
Pricing - At the time of writing (Sept. 2010), a ""no-commitment" price of $349.99 was set by the US wireless carrier AT&T.
Availability - assumed global
For the purposes of this teardown analysis, we have assumed a lifetime production volume of 3M units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Main Cost Drivers Representing ~80% of total materials cost
Qualcomm - QSD8250 - Baseband Processor - Quad-Band GSM/GPRS/EDGE, UMTS HSPA, 1GHz CPU, 600MHz DSP, WiFi, Bluetooth, gpsOne, 3D Graphics, Mobile Broadcast TV
Display Module Value Line Item - 4.0' Diagonal, 65K Color TFT LCD, 854 x 480 Pixels
Micron Technology - MT29C8G72MAPATFJR-6 IT - MCP - 8Gb NAND Flash + 3Gb Mobile SDRAM (Estimated)
Camera Module Value Line Item - 8.1MP CMOS, 1/3' Format, Auto Focus Lens
Touchscreen Assembly / Display Window - 4.0' Diagonal, Capacitive, Glass Overlay, Painted, Printed
Panasonic - 8-Layer - FR4 HDI, Stacked Via
Fujitsu - MBG037 - Multimedia Co-Processor
Bluetooth/WLAN Module Value Line Item - IEEE802.11b/g, Bluetooth V2.0+EDR, Contains Atheros AR6002GZ
BST-41 - Battery - Li-Polymer, 3.6V, 1500mAh, 5.4Wh
Qualcomm - PM7540 - Power Management IC - w/ Integrated USB Transceiver
Qualcomm - MXU6219 - RF Transceiver - Quad-Band GSM/GPRS/EDGE, Tri-Band WCDMA, HSDPA/HSUPA
Salcomp - CST-80 - Charger - 5V, 700mA, AC to USB Type A
Cypress Semiconductor - CY8C20466-24LQXI - Touchscreen Controller - Capacitive, SoC
Texas Instruments - TPS65023RSB - Power Management IC - Battery Charger, Li-ion, 3 Step-Down DC-DC Converters, 2x 200mA LDO Regulators
Total BOM Cost $144.10
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
Country of Origin / Volume Assumptions
Based on markings, the unit was assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as display module), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The Sony Ericsson Xperia X10 has an overall component count of 1093 (excluding box contents), of which 822 components reside on the Main PCB assembly. Compared to other smartphones we've analyzed in the past, the X10 occupies the upper ranges of the complexity curve (>1000 parts).
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
Here is a summary of the major components used in the SonyEricsson Xperia X10 design:
- Baseband Processor - Qualcomm - QSD8250
- Multimedia Co-Processor - Fujitsu - MBG037
Battery / Power Management
- Power Management IC - Qualcomm - PM7540
- LED Driver - Sanyo - LV5219
- Power Management IC - Texas Instruments - TPS65023RSB
- MCP - Micron Technology - MT29C8G72MAPATFJR-6 IT
- RF Transceiver IC - Qualcomm - MXU6219
Bluetooth / FM / WLAN
- Bluetooth/WLAN Module (IEEE802.11b/g, Bluetooth V2.0+EDR) - Contains Atheros AR6002GZ
- Display Module - 4.0' Diagonal, 65K Color TFT LCD, 854 x 480 Pixels