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Sharp TU-X1U AVC Unit Teardown

04 August 2009
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

This teardown analysis belongs with the 'Sharp Aquos LC-52XS1U LCD Television' analysis report. Please refer to that report for overall product description, television monitor cost analysis and executive summary stating general analysis assumptions and methodologies.

Sharp TU-X1U AVC Unit Main ImageSharp TU-X1U AVC Unit Main Image

Cost Notes Main Cost Drivers Representing ~62% of total materials cost

Broadcom - BCM3553KFEB5G - Digital TV Processor - Soc, 1080P

Enclosure, Main, Bottom - Stamped / Formed Electro-Galvanized Steel, 6-Pieces Riveted

Hitachi Chemical Co. - 4-Layer - FR4, Lead-Free

Sharp - Tuner Module Value Line Item

Samsung Semiconductor - K4H511638D-UCCC - SDRAM - DDR, 512Mb(32Mb x 16), 2.6V (Qty:4)

Enclosure, Main, Top - Stamped / Formed Electro-Galvanized Steel, Black Painted

Silicon Image - Sil9135ACTU - HDMI Receiver - V1.3, Dual Input, DVI 1.0, EIA/CEA-861D, HDCP 1.1

Tabuchi Electric - Power Supply - AC-DC, Switchmode, 35W (Estimated)

Xilinx - XC3S250E-4FTG256C - FPGA - 250K Gates, 5508 Logic Cells, 172 MAX User I/Os, Distributed RAM: 38Kb, Block RAM: 216Kb

Total BOM Cost $198.39

Sharp TU-X1U AVC Unit Cost AnalysisSharp TU-X1U AVC Unit Cost Analysis

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.



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