Overview / Main Features
The Huawei EM770W is an embedded WWAN module (in PCIe Mini card format) featuring Qualcomm's MSM6290 baseband and supports a quad-band HSPA and GPRS/EDGE radio. As a Qualcomm design, the embedded WWAN module also contains a Qualcomm RTR6285 RF transceiver and PM6658 power management IC. Mobile DDR and flash memory is provided by a Samsung multi-chip package featuring 512Mb NAND and 256Mb mobile DDR.
Mobile Device OEMs / Wireless Broadband Service Providers
Pricing - Unknown, typically embedded WWAN modules do not have published pricing as they are sold (through contracts to OEMs and service providers)
Availability - Assumed global
For the purposes of this teardown analysis, we have applied a lifetime production volume of approximately 4M units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Main Cost Drivers ~75% of Total Materials Cost
Qualcomm - MSM6290 - Baseband Processor - Quad-Band GSM/EDGE, WCDMA/HSPA, 7.2Mbps HSDPA, 5.76Mbps HSUPA, Support 5M Camera & High-Speed USB, Integrated A-GPS
Samsung Semiconductor - K5D1258DCB-D090 - MCP - 512Mb NAND Flash + 256Mb Mobile SDRAM
Qualcomm - RTR6285 - RF Transceiver - ZIF, Quad-Band GSM/EDGE, Tri-Band UMTS Transceiver, HSDPA, w/ Integrated GPS Receiver & Receive Diversity
Qualcomm - PM6658 - Power Management IC - w/ Integrated USB Transceiver
10-Layer - FR4/RCF HDI, 3+4+3, Lead-Free
Murata - FEM - Quad-Band GSM & WCDMA Antenna Switch, w/ RF RX SAW Filters
TriQuint Semiconductor - TQM7M5012 - PAM - Quad-Band GSM/EDGE
Texas Instruments - TPS61030RSA - Regulator - DC-DC Converter, Synchronous Boost, Adjustable, 1A
NDK - NT3225SA-19.2M-NSA0322T - TCXO - 19.200MHz
Avago Technologies - ACPM-7331 - PAM - WCDMA/HSDPA 1900
Direct Materials + Manufacturing $30.99
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
Country of Origin / Volume Assumptions
Based on markings, the unit was likely assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as SMT covers), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The Huawei embedded WWAN module has an overall component count of 499.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
Here is a summary of the major components used in the Huawei EM770W WWAN Module design:
- Baseband Processor - Qualcomm - MSM6290
- MCP - Samsung Semiconductor - K5D1258DCB-D090, 512Mb NAND Flash + 256Mb Mobile SDRAM
- Power Management IC - Qualcomm - PM6658
RF / PA
- RF Transceiver - Qualcomm - RTR6285