Overview / Main Features
The Dell Mini 10 (Inspiron 1010) under analysis here is a wireless broadband (3G) enabled netbook computer. Netbooks with built-in WWAN or wireless 3G modules are typically configured for and offered through major wireless network service providers such as AT&T, Verizon, T-Mobile and Sprint. This Inspiron 1010 [purchased directly from Dell] comes with an Ericsson F3507g embedded 3G module that is compatible with AT&T's HSPA network.
From the perspective of a netbook, the Inspiron 1010 is an Intel Atom Z520 (1.33GHz) powered computer. Paired with the Intel US15W System Controller Hub, both the CPU and integrated, single chip chipset (as well as the 1GB of SDRAM) resides on a separate CPU/Chipset PCB and connected to the motherboard via a DDR2 connection and bus. According to Intel, the Z5xx series of Atom processors are lower power consuming CPUs that are intended for UMPCs and MID devices. The fact that we see them in a netbook format demonstrates the flexibility of the Atom CPU platform. Also, this specific configuration of the Dell Mini 10 represents a bit of an "in-between technology as most PC manufacturers are now migrating from the N270 (single core) to the N4xx series (dual-core) Atom processors for their netbook offerings.
Overall, the 10.1" netbook comes equipped with a 160GB hard disk drive and a Broadcom 802.11b/g WLAN module. The Dell offers usual assortments of connectivity (i.e. RJ-45, USB 2.0, audio) as well as a HDMI port. The netbook comes standard with a removable 3 cell 2500mAh battery.
Mobile Professionals / ""Road Warriors"
Per secondary research, first announced in Jan 2009 and subsequently released in Q1 2009.
Pricing - For this specific configuration, the netbook cost approximately $550 direct from Dell.com
Availability - North America [due to configuration to work on AT&T 3G network]
For the purposes of this teardown analysis, we have assumed a lifetime production volume of 1M units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Main Cost Drivers Representing ~75% of total materials cost
Ericsson - F3507g - WWAN Mini PCIe Module - HSPA/WCDMA/EDGE/GPRS & GPS, WCDMA 2100/1900/850MHz & GPRS/EDGE 850/900/1800/1900MHz
Samsung Electronics - HM160HI - Hard Drive - 160GB, 2.5', SATA 1.5Gb/s, 5400RPM, 8MB Buffer
Chi Mei Optoelectronics - N101L6-L01 - Display Module Value Line Item - 10.1' Diagonal, 262K Color TFT, 1024 x 600 Pixels (WSVGA), 222.72mm x 125.28mm Viewable Area, 217.5um x 208.8um Pixel Pitch, 16:9 Aspect Ratio, 200cd/m^2, 500:1 Contrast Ratio, 10ms Response Time
Intel - AC80566UE014DW - CPU - Intel Atom Processor Z520, 1.33GHz, 512KB L2 Cache, 533MHz FSB, 45nm Process
Intel - AF82US15W - Northbridge / Southbridge - Graphics, Memory & I/O Controller Hub (SCH US15W)
Dynapack - Battery Pack - Li-Ion, 11.1V, 2500mAh, 28Wh
Samsung Semiconductor - K4T1G164QQ-HCF7 - SDRAM - DDR2-800, 1Gb (64M x 16), 1.8V (Qty:8)
Broadcom - BCM94312HMG - WLAN Half Mini PCIe Module - IEEE802.11b/g
Total BOM Cost $290.03
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
OEM/ODM/EMS Relationships / Manufacturing
According to iSuppli's Global OEM Manufacturing and Design Analysis (GOMDA) Compute Platform Q2 2009 report, Dell outsources 100% of their netbook among Wistron, Quanta and Compal with 35%, 34% and 29% manufacturing split respectively.
Country of Origin / Volume Assumptions
Based on markings, the unit was assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as WLAN module), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The Dell Mini 10 netbook has an overall component count of 1344 (excluding Box Contents), of which, 277 is mechanical in nature. This complexity level is on par with other netbooks from Acer and HP we have analyzed in the past.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
The Dell Inspiron 1010 / Mini 10 is the first netbook we've encountered with an Intel Atom Z520 and integrated System Controller Hub US15W platform. Also, the CPU and chipset resides on the same PCB as the SDRAM using the DDR2 bus. This usual design appears to reflect the intended use of the CPU as a processor for UMPC/MID and not one typical of a miniature notebook / netbook design.
Also, the Ericsson F3507g embedded WAN module is a common HSPA embedded design which we have analyzed [separate teardown] in the past and supports primarily AT&T network due to its3G frequencies compatibility.
Interestingly, Dell uses a trackpad solution from ELAN - a relatively minor player in the touchpad solutions arena. Typically, we see Synaptics in this design slot.
Here is a summary of the major components used in the Dell Mini 10 (Inspiron 1010) 3G netbook design:
CPU / Chipset Card
- Intel - AF82US15W - System Controller Hub (SCH US15W)
- Intel - AC80566UE014DW - Intel Atom Processor Z520, 1.33GHz
- SDRAM -Samsung Semiconductor - K4T1G164QQ-HCF7, DDR2-800, 1Gb (64M x 16), 1.8V, Qty. 8
- Ericsson - F3507g - HSPA/WCDMA/EDGE/GPRS & GPS, WCDMA 2100/1900/850MHz & GPRS/EDGE 850/900/1800/1900MHz
I/O & Interface
- I/O Controller - ENE Technology Inc. - KB926QF
- HDMI Transmitter -Silicon Image - SiI1392CNU
- PATA/SATA Bridge Controller - Genesys Logic - GL831
- Display Module - Chi Mei Optoelectronics - N101L6-L01, 10.1' Diagonal, 262K Color TFT, 1024 x 600 Pixels (WSVGA
- Hard Drive - Samsung Electronics - HM160HI (160GB, 2.5', SATA 1.5Gb/s, 5400RPM, 8MB Buffer)