Acquired Electronics360

Mobile Devices

HP G62t-250 Notebook Computer Teardown

05 October 2010
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Overview / Main Features

The HP G62t-250 is a general consumer, 15.6-inch display notebook computer powered by an Intel Core i3 350M processor and HM55 Express Chipset. This HP laptop under analysis is configured with 4GB of DDR3-1333 of memory [on two SO-DIMM modules], a 250GB hard-disk drive [running at 7200rpm], an 802.11n-capable WLAN module, as well as a lithium ion 6-cell battery. Also, the G62t-250 comes with a CD/DVD RW optical drive and a integrated VGA resolution webcam.

HP G62t-250 Notebook Computer Main ImageHP G62t-250 Notebook Computer Main Image

Target Market

Consumers

Released

Per press releases, first release in early 2010.

HP G62t-250 Notebook Computer - Motherboard TopHP G62t-250 Notebook Computer - Motherboard Top

Pricing and Availability

Pricing - While the HP G62t-250 is no longer on sale, past price listed pegs the laptop at approximately $700.

Availability - Assumed global

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 2M units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Market Sector / Performance

HP, according to iSuppli's PC Market Share Q1 2010 database, is ranked as the number 1 notebook PC maker with approximately 15 million units shipped worldwide. This gives the US PC maker a 19.6 percent market share and a quarter on quarter decrease in volume of 6.3%.

HP G62t-250 Notebook Computer Cost AnalysisHP G62t-250 Notebook Computer Cost Analysis

HP G62t-250 Notebook Computer Cost Analysis
Cost Notes

Main Cost Drivers Representing ~85% of total materials cost

Intel - CP80617004161AC - CPU - Intel Core i3-350M, Dual Core, 2.26GHz, 3MB L3 Cache, 32nm Process

Kingston - HP594908-HR1-ELD - SO-DIMM DDR3-1333 - 2GB, 256Mx64, 1.5V (Qty:2)

Samsung - LTN156AT05 - Display Module Value Line Item - 15.6' TFT LCD, TN Mode, 1366 x 768 Pixels, 0.252mm x 0.252mm Pixel Size, 262K Colors, 200cd/m^2 Brightness, 16ms Response Time, Active Area: 348.2mm x 197.2mm, LED Backlight

Toshiba Storage Device - MK2556GSY - Hard Drive - 250GB, 2.5' SATA 3Gb/s, 7200RPM, 16MB Buffer

Hitachi-LG Data Storage - TS-L633 - CD/DVD RW Drive - Slim Internal Type, Tray Load, SATA

Dynapack - HSTNN-DB0W - Battery Pack - Li-Ion, 6-Cell, 10.8V, 4200mAh, 47Wh

Intel - BD82HM55SLGZS - Platform Controller Hub - HM55 Express Chipset, 65nm

HannStar - 6-Layer - FR4, Lead-Free, Halogen-Free

Delta Electronics - PPP009D - AC Adapter - 18.5V, 3.5A, 65W, w/ 6ft Cord & Velcro Strap

Keyboard Assembly - Injection Molded Plastic Keys, Mounted on Metal Backing Plate, w/ Interconnect Flex

WLAN Half Mini PCIe Module Value Line Item - IEEE802.11b/g/n, 1x2 MIMO

Enclosure, Main, Bottom - Injection Molded ABS Polycarbonate, w/ ESD/EMI Coating & 20 Brass Threaded Inserts

Materials and Manufacturing $472.87

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

HP's Mobile PC manufacturing profile, according to iSuppli's Global OEM Manufacturing and Design Analysis - GOMDA), is primarily an outsourced model with only 1.3% in house manufacturing capacity. HP uses Taiwanese ODMs as their outsourced manufacturing partners with Quanta, Compal and Inventec taking a 34%, 27% and 27% respectively.

Country of Origin / Volume Assumptions

Based on markings, the unit was likely assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as display module), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

HP G62t-250 Notebook Computer - Motherboard BottomHP G62t-250 Notebook Computer - Motherboard Bottom

Design for Manufacturing / Device Complexity

The HP G620t-250 has an overall component count of 1638 (excluding box contents), of which 1193 resides on the motherboard. This level of complexity is typical of notebook computer at this specification.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

Here is a summary of the major components used in the HP G620t-250 design:

Display

  • Display Module - Samsung - LTN156AT05, 15.6' TFT LCD, TN Mode, 1366 x 768 Pixels, 0.252mm x 0.252mm Pixel Size, 262K Colors, 200cd/m^2 Brightness, 16ms Response Time, Active Area: 348.2mm x 197.2mm, LED Backlight

Motherboard

Chipset

  • Platform Controller Hub - Intel - BD82HM55SLGZS, HM55 Express Chipset

CPU

  • CPU - Intel - CP80617004161AC, Intel Core i3-350M, Dual Core, 2.26GHz, 3MB L3 Cache, 32nm Process

I/O & Interface

  • Keyboard Controller - Ene Technology - KB3926QF, LPC Interface, Programmable GPIO, PWM, Fan Controller, 8-Bit D/A, 10-Bit A/D
  • WLAN - Realtek - RTL8191SE-VA2, Single Chip, MAC/Baseband Processor/Radio, 802.11b/g/n, 2.4GHz, 1x2 MIMO
  • PC Camera Processor - Vimicro - VC0345TLNAH, Up to 3MP, USB 2.0 Interface
  • Audio Codec - Realtek - ALC270
  • Ethernet Controller - Realtek - RTL8103EL-GR, 10/100 Mbps, PCI Express Interface
  • Memory Card Reader Controller - Realtek - RTS5159-GR, SD/MMC/xD/MS/MS Pro

Memory Module

  • SO-DIMM - Kingston - HP594908-HR1-ELD, DDR3-1333 - 2GB, 256Mx64, 1.5V, Qty. 2

Communication Modules

  • WLAN Half Mini PCIe Module - IEEE802.11b/g/n, 1x2 MIMO

Storage Devices

  • Hard Drive - Toshiba Storage Device - MK2556GSY, 250GB, 2.5' SATA 3Gb/s, 7200RPM, 16MB Buffer
  • CD/DVD RW Drive - Hitachi-LG Data Storage - TS-L633, Slim Internal Type, Tray Load, SATA

Battery

  • Battery Pack - Dynapack - HSTNN-DB0W, Li-Ion, 6-Cell, 10.8V, 4200mAh, 47Wh

"

HP G62t-250 Notebook Computer - Box ContentsHP G62t-250 Notebook Computer - Box Contents



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement