Overview / Main Features
The HP G62t-250 is a general consumer, 15.6-inch display notebook computer powered by an Intel Core i3 350M processor and HM55 Express Chipset. This HP laptop under analysis is configured with 4GB of DDR3-1333 of memory [on two SO-DIMM modules], a 250GB hard-disk drive [running at 7200rpm], an 802.11n-capable WLAN module, as well as a lithium ion 6-cell battery. Also, the G62t-250 comes with a CD/DVD RW optical drive and a integrated VGA resolution webcam.
Per press releases, first release in early 2010.
Pricing - While the HP G62t-250 is no longer on sale, past price listed pegs the laptop at approximately $700.
Availability - Assumed global
For the purposes of this teardown analysis, we have assumed a lifetime production volume of 2M units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Market Sector / Performance
HP, according to iSuppli's PC Market Share Q1 2010 database, is ranked as the number 1 notebook PC maker with approximately 15 million units shipped worldwide. This gives the US PC maker a 19.6 percent market share and a quarter on quarter decrease in volume of 6.3%.
HP G62t-250 Notebook Computer Cost Analysis
Main Cost Drivers Representing ~85% of total materials cost
Intel - CP80617004161AC - CPU - Intel Core i3-350M, Dual Core, 2.26GHz, 3MB L3 Cache, 32nm Process
Kingston - HP594908-HR1-ELD - SO-DIMM DDR3-1333 - 2GB, 256Mx64, 1.5V (Qty:2)
Samsung - LTN156AT05 - Display Module Value Line Item - 15.6' TFT LCD, TN Mode, 1366 x 768 Pixels, 0.252mm x 0.252mm Pixel Size, 262K Colors, 200cd/m^2 Brightness, 16ms Response Time, Active Area: 348.2mm x 197.2mm, LED Backlight
Toshiba Storage Device - MK2556GSY - Hard Drive - 250GB, 2.5' SATA 3Gb/s, 7200RPM, 16MB Buffer
Hitachi-LG Data Storage - TS-L633 - CD/DVD RW Drive - Slim Internal Type, Tray Load, SATA
Dynapack - HSTNN-DB0W - Battery Pack - Li-Ion, 6-Cell, 10.8V, 4200mAh, 47Wh
Intel - BD82HM55SLGZS - Platform Controller Hub - HM55 Express Chipset, 65nm
HannStar - 6-Layer - FR4, Lead-Free, Halogen-Free
Delta Electronics - PPP009D - AC Adapter - 18.5V, 3.5A, 65W, w/ 6ft Cord & Velcro Strap
Keyboard Assembly - Injection Molded Plastic Keys, Mounted on Metal Backing Plate, w/ Interconnect Flex
WLAN Half Mini PCIe Module Value Line Item - IEEE802.11b/g/n, 1x2 MIMO
Enclosure, Main, Bottom - Injection Molded ABS Polycarbonate, w/ ESD/EMI Coating & 20 Brass Threaded Inserts
Materials and Manufacturing $472.87
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
HP's Mobile PC manufacturing profile, according to iSuppli's Global OEM Manufacturing and Design Analysis - GOMDA), is primarily an outsourced model with only 1.3% in house manufacturing capacity. HP uses Taiwanese ODMs as their outsourced manufacturing partners with Quanta, Compal and Inventec taking a 34%, 27% and 27% respectively.
Country of Origin / Volume Assumptions
Based on markings, the unit was likely assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as display module), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The HP G620t-250 has an overall component count of 1638 (excluding box contents), of which 1193 resides on the motherboard. This level of complexity is typical of notebook computer at this specification.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
Here is a summary of the major components used in the HP G620t-250 design:
- Display Module - Samsung - LTN156AT05, 15.6' TFT LCD, TN Mode, 1366 x 768 Pixels, 0.252mm x 0.252mm Pixel Size, 262K Colors, 200cd/m^2 Brightness, 16ms Response Time, Active Area: 348.2mm x 197.2mm, LED Backlight
- Platform Controller Hub - Intel - BD82HM55SLGZS, HM55 Express Chipset
- CPU - Intel - CP80617004161AC, Intel Core i3-350M, Dual Core, 2.26GHz, 3MB L3 Cache, 32nm Process
I/O & Interface
- Keyboard Controller - Ene Technology - KB3926QF, LPC Interface, Programmable GPIO, PWM, Fan Controller, 8-Bit D/A, 10-Bit A/D
- WLAN - Realtek - RTL8191SE-VA2, Single Chip, MAC/Baseband Processor/Radio, 802.11b/g/n, 2.4GHz, 1x2 MIMO
- PC Camera Processor - Vimicro - VC0345TLNAH, Up to 3MP, USB 2.0 Interface
- Audio Codec - Realtek - ALC270
- Ethernet Controller - Realtek - RTL8103EL-GR, 10/100 Mbps, PCI Express Interface
- Memory Card Reader Controller - Realtek - RTS5159-GR, SD/MMC/xD/MS/MS Pro
- SO-DIMM - Kingston - HP594908-HR1-ELD, DDR3-1333 - 2GB, 256Mx64, 1.5V, Qty. 2
- WLAN Half Mini PCIe Module - IEEE802.11b/g/n, 1x2 MIMO
- Hard Drive - Toshiba Storage Device - MK2556GSY, 250GB, 2.5' SATA 3Gb/s, 7200RPM, 16MB Buffer
- CD/DVD RW Drive - Hitachi-LG Data Storage - TS-L633, Slim Internal Type, Tray Load, SATA
- Battery Pack - Dynapack - HSTNN-DB0W, Li-Ion, 6-Cell, 10.8V, 4200mAh, 47Wh