Overview / Main Features
The HTC Wildfire is one of a new breed of affordable smartphones featuring Android and Qualcomm MSM72xx baseband processors designed to drive down overall BOM costs. The 3.2 inch touchscreen handset represents a significant size reduction to the typical 3.7 inch designs seen on the high-end Android handsets but the Wildfire does pack most, if not all, of the features found in the more costly devices such as capacitive touch, 5MP camera, GPS, BT/WLAN, accelerometer and even HTC's much lauded Sense UI overlay.
Overall, the dual-band UMTS / quad-band GSM handset is HSDPA capable on 900 and 2100 MHz frequencies making the device a European and Asian centric 3G handset. The Wildfire has approximately 4Gb of onboard NAND which is partitioned and shared with the OS image. Also, a 2GB microSD card is made available to off load additional storage needs.
Affordable smartphone segment
Pricing - An unlocked version of the Wildfire sells thru various online retailers in the US for approximately $350. Elsewhere in its targeted markets, the Wildfire likely is offered for free with service contracts.
Availability - Europe and Asia
For the purposes of this teardown analysis, we have applied a lifetime production volume of approximately 2M units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Main Cost Drivers ~80% of Total Materials Cost
Qualcomm - MSM7225 - Baseband Processor - Quad-Band GSM/EDGE, UMTS, HSDPA 7.2Mbps, HSUPA 5.76Mbps, Integrated 528MHz ARM11 Applications Processor, 65nm
Display Module Value Line Item - 3.2' Diagonal, 16.7M Color TFT, 240x320 Pixels
Samsung Semiconductor - KA1000012M-BJTT - MCP - 4Gb NAND Flash + 3Gb Mobile DDR (Estimated)
Touchscreen Assembly - 3.5' Diagonal, Capacitive, ITO Film Over Glass Faceplate, Painted, w/ Integral Flex PCB, & Board to Board Connector
Camera Module Value Line Item - 5.1MP, CMOS, 1/4' Format, Auto Focus Lens
UniMicron Technology - 10-Layer - FR4/RCF HDI, 3+4+3, Lead-Free
Broadcom - BCM4329EKUBG - Bluetooth/FM/WLAN - Single Chip, WLAN IEEE802.11a/b/g/n, Bluetooth V2.1+EDR, FM Radio Receiver & Transmitter, 65nm
Samsung Semiconductor - MMAGR02GUECA-2MB - MicroSD Memory Card - 2GB
BB96100 - Battery - Li-Ion, 3.7V, 1300mAh
Emerson Network Power - TC E250 - Charger - AC to USB, 5V, 1A
Qualcomm - PM7540 - Power Management IC - w/ Integrated USB Transceiver
Qualcomm - RTR6285 - RF Transceiver - ZIF, Quad-Band GSM/EDGE, Tri-Band WCDMA/HSDPA Transceiver w/ Receive Diversity, Integrated GPS Receiver
Atmel - ATMXT224-CU - Touchscreen Controller - Capacitive, 12-bit, 224-Channel, w/ I2C Compatible Interface
Handsfree Accessory - Stereo, Earphone / Microphone, w/ Single Control Button & Plastic Clip
Skyworks - SKY77336-21 - PAM - Quad-Band GSM/GPRS/EDGE, w/ Integrated Power Control
Optical Trackpad PCB Assembly Value Line Item
Direct Materials + Manufacturing $115.85
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
Country of Origin / Volume Assumptions
Based on the level of sophistication and function of the device, we made the assumption that the unit was assembled in Taiwan. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in Taiwan.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as display), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The HTC Wildfire under analysis here has an overall component count of 834 (excluding box contents), of which, 722 reside on the main PCB. HTC typically occupy the extreme ends of our complexity chart. Even for a purported low-end smartphone, the Wildfire comes in at higher than most other OEMs like Nokia and Samsung for the same level of functionality.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for Taiwan.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
The Wildfire features an updated MSM7225 baseband processor. We have seen MSM7200 series baseband processors in the first generation Android handsets. Since then, most handset OEMs have updated to QSD8x50 series Snapdragon baseband processors for their high end offerings. Qualcomm respun the MSM7225 for the low cost smartphone segment which makes it an excellent candidate for this slot in a device like the Wildfire.
The 3.2 inch display used in the Wildfire is 320 x 240 resolution - the lowest resolution currently supported on HTC Android handsets but does give the OEM a considerable savings in BOM cost.
On the user interface front, HTC maintains the manufacturer slots for acceleromenter (Bosch), e-compass (AKM) and capacitive touch controller (Atmel).
Here is a summary of the major components used in the HTC Wildfire design:
- Display Module - 3.2' Diagonal, 16.7M Color TFT, 240x320 Pixels
Apps Processing / Baseband
- Baseband Processor - Qualcomm - MSM7225
BT / FM / GPS / WLAN
- Bluetooth/FM/WLAN - Broadcom - BCM4329EKUBG
- MCP - Samsung Semiconductor - KA1000012M-BJTT, 4Gb NAND Flash + 3Gb Mobile DDR (Estimated)
RF / PA
- RF Transceiver - Qualcomm - RTR6285
- PAM - Skyworks - SKY77336-21, Quad-Band GSM/GPRS/EDGE, w/ Integrated Power Control
- PAM - Avago Technologies - ACPM-5408, WCDMA/HSDPA 900, 880-915MHz
- PAM - Avago Technologies - ACPM-5401, WCDMA/HSDPA 2100, 1920-1980MHz
- Touchscreen Controller - Atmel - ATMXT224-CU
- Electronic Compass - AKM Semiconductor - AK8973S
- Accelerometer - Bosch Sensortec - BMA150