Overview / Main Features
The LG Voyager VX10000 is a horizontal-flip phone and available in two flavors, one as a generic dual-band CDMA version, and the other as a Verizon version of which this report is based on. It is the successor to the VX9900 and VX9800 and has implemented major improvements over the previous two devices. The Voyager VX10000 from LG was hailed as an early iPhone killer by enthusiasts but this phone is different to the iPhone in multiple aspects. The most obvious differences are the CDMA nature of the device, dual screen, QWERTY-keyboard, and the VCast Live Mobile TV capability via Qualcomm's MediaFLO tecnology . This phones" RF connectivity includes EV-DO, Bluetooth, and GPS. Both the internal and external displays are measured to be 2.8?and support 262K colors @ 400x240 pixels. The external display also has touchscreen function with tactile feedback. Other features on this phone include a 2.0MP camera, stereo speakers, MicroSD card slot, and 2.5mm headphone jack.
High-end smartphone with focus on the media-centric market segment
Online release is Nov. 18th 2007 and stores release is Nov. 21st 2007 in the US.
Pricing and Availability
Pricing - The original cost during release was $299 USD with a 2-year contract through Verizon Wireless and was lowered to $200, $150, $130, and eventually $100. The LG Voyager in Titanium can be had on Verizon Wireless online store for $129.99 with a $50 discount which comes to $79.99 with a 2-year contract.
Availability - This version of the LG Voyager VX10000 is only available through the exclusive carrier Verizon Wireless.
For the purposes of this teardown analysis, we have assumed a lifetime production volume of 1M units based in assumption of 2 year product life.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed, volumes increment by an order of magnitude. Minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis.
iSuppli's Design Forecast Tool (DFT) and Market Shares
As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design feature and manufacture, as well as the number of design starts a manufacturer will have by feature set.
iSuppli estimates unit shipments of 242 million CDMA EVDO and 279 million 2MP camera phone handsets in 2008 global market.
Main Cost Drivers (Representing ~71% of total materials cost)
$26.10 - Display Module - Dual 2.8" Diagonal, 262K Color TFT, 400x240 Pixels
$15.95 - MSM6550 - Qualcomm - Baseband Processor - Single-Chip, CDMA2000 1X / 1xEV-DO, Dual-Band GSM/GPRS, Bluetooth, Integrated Dual QSDO4000 DSP & 225MHz ARM926EJ-S uProcessor
$8.00 - Camera Module - 2.0MP, CMOS, 1/4" Format, Auto Focus Lens
$5.60 - TYA000BC10H0GG - Toshiba Semiconductor - MCP - 2Gb NAND Flash + 1Gb Mobile SDRAM
$4.51 - MBD1000 - Qualcomm - Multicast Chipset - for CDMA2000 and WCDMA (UMTS) Chipsets
$3.15 - Battery - Li-Ion Polymer, 3.7V, 950mAh
$3.05 - Keypad Assembly - Injection Molded Plastic and Metal Keys, Silkscreened, Painted, Chromed, on Co-Molded Silicone Rubber and Electroluminescent Backlight Substrate
$2.97 - LG Micron - 10-Layer - FR4/RCF HDI, 2+6+2
$2.30 - RFR6500 - Qualcomm - RF Receiver - ZIF, Dual-Band, CDMA2000 1X, 800/1900MHz, GPS
$1.96 - LG Micron - 6-Layer, Flex Kapton w/ Stiffener
Direct Materials Costs $103.70
Materials and Manufacturing $109.56
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself ?cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEME margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
OEM/ODM/EMS Relationships / Manufacturing
According to iSuppliE ?lobal OEM Manufacturing and Design Analysis ?Mobile Handsets Q1 2008? LG conducts much of the final assembly in-house throughout their various global operations while utilizing EMS providers to source mobile handset modules and sub-assemblies. iSuppli estimates that almost 6% of the sub-assemblies in handsets produced in 2007 were produced by their contract manufacturers.
LG maintains worldwide manufacturing operations in North America (Mexico), South America (Brazil), Asia Pacific region (Korea), Greater China, Southeast Asia and South Asia. iSuppli estimates that LG used 2 EMS providers in 2007 with comprising of Arima Communications and Flextronics.
Country of Origin / Volume Assumptions
Based on markings, the unit was assembled in Korea. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were sourced in lower cost regions within China.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of "finished" sub-assemblies (such as display), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ?uto?inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pin-count of the device. This calculation is affected by country or region of origin as well.
Component count 718, This is a favorable component count when compared with other models of similar functionality. This is a good, modest component count.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
The LG VX10000 Voyager utilizes the Qualcomm MSM6550 Baseband Processor as the brain of the device. The MSM6550 baseband processor has integrated two QSDO4000 Digital Signal Processor and a 225MHz ARM926EJ-S microprocessor inside, which should be adequate for the media processing of this phone. Memory IC used in this phone is a Multi-Chip Package Toshiba Semiconductor TYA000BC10H0GG that has 2Gb NAND flash and 1Gb Mobile SDRAM. MaximE MAX8695G performs the power management function.
The RF section of the phone is controlled by two chips; Qualcomm RFT6150 and RFR6500, in charge of transmit and receive, respectively. The combination of RFT6150 and RFR6500 is common amongst CDMA handset as it is one of the reference chipset from Qualcomm. These two chips are commonly used with other MSM-Series baseband processors. The RFR6500 is capable of receiving 800MHz and 1900MHz frequencies for CDMA and GPS frequency of 1575MHz which fits nicely with the MSM6550E GPS capability. Anadigics?AWT6321RM28Q7 is a dual-band CDMA power amplifier module interfacing the RFT6150 chip to provide reliable transmit power to the antenna.
MediaFLO technology is also a selling feature on this handset and is powered by two chips, the Qualcomm RBR1000 and MBD1000. The MBD1000 and the RBR1000 chipsets is offered with the MSM6550 as a companion solution for CDMA2000 and QualcommE own MediaFLO.
There are two identical displays within this phone, an external and an internal, of which the external has a touchscreen. Each of the display has 2.8?diagonal size, 262K Color, and 400x240 pixels WQVGA resolution. The touchscreen is a 4-wire resistive type and is controlled by a Texas Instruments TSC2007IYZG 12-Bit touchscreen controller.
- DBB - Qualcomm - MSM6550 - Baseband Processor, Single-Chip, CDMA2000 1X / 1xEV-DO, Dual-Band GSM/GPRS, Bluetooth, Integrated Dual QSDO4000 DSP & 225MHz ARM926EJ-S uProcessor
- ABB - Maxim - MAX8695G - Power Management IC
- MCP - Toshiba Semiconductor - TYA000BC10H0GG - 2Gb NAND Flash + 1Gb Mobile SDRAM
- PAM - Anadigics - AWT6321RM28Q7 - CDMA, Dual Band, 800/1900MHz
- RF Transmitter - Qualcomm - RFT6150 - ZIF, Dual-Band, CDMA2000 1X
- RF Receiver - Qualcomm - RFR6500 - ZIF, Dual-Band, CDMA2000 1X, 800/1900MHz, GPS
- Radio Receiver - Qualcomm - RBR1000 - 700MHz Spectrum, for CDMA2000 and WCDMA (UMTS) Chipset Interface
- Multicast Chipset - Qualcomm - MBD1000 - for CDMA2000 and WCDMA (UMTS) Chipsets
- Microcontroller - Point Chips - PP2106M - Single Chip, 16KBytes Mask ROM, 34 General Purpose I/O Pins, for Low Power USB and PS/2 Keyboard Control
Top Button PCB
- Touch Screen Controller - Texas Instruments - TSC2007IYZG - 12-Bit, Nanopower, 4-Wire, w/ I2C Interface
- Dual 2.8" Diagonal, 262K Color TFT, 400x240 Pixels