Acquired Electronics360

Mobile Devices

Samsung Pixon (SGH-M8800) Mobile Phone Teardown

30 November 2012
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Overview / Main Features

The Samsung Pixon 8800H is a high end, HSDPA/UMTS/GSM/EDGE (3.5 G) PDA-format touchscreen phone, with one of the key features being its 8MP auto-focus camera, and LED "flash'. Just like the simultaneously-analyzed LG Renoir KC910, this model looks like a touchscreen phone on one side, and like a point and shoot camera on the other - which is aesthetically designed to blur the line between digital still cameras and feature phones.

Samsung Pixon (SGH-M8800) Mobile Phone - Exploded ViewSamsung Pixon (SGH-M8800) Mobile Phone - Exploded View
The Pixon 8800H's touchscreen is resistive (unlike the iPhone and RIM's Storm with the superior capacitive screens), but the phone, like other Samsung models, features a haptic feedback mechanism that gives the screen a "kick" with every registered touch, which gives the user a tactile mechanism by which they instinctively feel that touch registration. Samsung's haptic feedback devices seem more effective than the Storm's "clickable" screen, or iPhones completely absent touch feedback. The display itself is a 3.2 WQVGA TFT display with 262K colors.

Samsung Pixon (SGH-M8800) Mobile Phone - Exploded ViewSamsung Pixon (SGH-M8800) Mobile Phone - Exploded View

Otherwise, despite having a high-end feature such as the 8MP camera, the Samsung cuts a few corners by not having special optics, or xenon flash for the camera, or having WLAN/WiFi connectivity. The Samsung, does, however, leverage the GPS functionality of it's core Qualcomm chipset to provide geo-tagging of photos, as does the LG Renoir KC910.

The Pixon 8800H is the thinnest touch screen camera phone offered by Samsung.

As a side note - the Samsung Pixon 8800H follows a very similar pattern to the competing LG Renoir KC910 in that this Pixon seems very similar, from a design point of view, to the previously analyzed Samsung Omnia SGH-i900 model (which was a 5MP camera featurephone).

Samsung Pixon (SGH-M8800) Mobile Phone - Main PCB TopSamsung Pixon (SGH-M8800) Mobile Phone - Main PCB Top
Target Market

This phone is intended by Samsung as a high-end Camera phone.

Released

The press releases and announcements for this phone appear to all be dated from September through Q4 2008.

Pricing and Availability

Pricing - Seen for as low as $379 USD from various online e-tailers at the time of writing (May 2009).

Availability - Worldwide technically, however seems like this is more Euro or

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 1.3M units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Market / Sector Performance

Overall, we forecast the handset market trimming back total shipments in 2009 to a little more than 1.1B units shipped (down from ~1.26B in 2008), with limited growth of ~1.17B units in 2010. Feature phones, or about 58% of the unit shipments will be feature phones in 2009, and will also be affected significantly by the downturn.

ISuppli's Design Forecast Tool (DFT) and Market Shares

As per our own research, specifically iSuppli's Design Forecast Tool (H2 2008), we see roughly 18.5% of unit shipments worldwide to be different variations of HSDPA in 2009, and that HSDPA shipments will represent roughly 22% of Samsung unit shipments in 2009. 8MP equipped camera phones, though are expected to represent a very small portion of worldwide shipments in 2009, but that figure should double year on year into 2010.

Based on our Mobile Handset Q1 2009 Market Tracker, Samsung is still the #2 player worldwide after Nokia, in terms of unit shipments on a worldwide basis with 16% of the market in 2008, and ever growing, Samsung took over the #2 spot from Motorola in 2007.

Samsung Pixon (SGH-M8800) Mobile Phone - Main PCB BottomSamsung Pixon (SGH-M8800) Mobile Phone - Main PCB Bottom
Cost Notes

Main Cost Drivers (Representing ~70% of total materials cost)

$32.00 - Primary Camera Module Value Line Item - 8.0MP CMOS, 1/3.2" Format, Auto Focus Lens

$20.83 - MSM6281 - Qualcomm - Baseband Processor - Single Chip, GSM/EDGE, WCDMA/HSDPA up to 7.2Mbps, w/ Integrated MDDI & Bluetooth 1.2 Baseband Processor

$12.40 - Display Module Value Line Item - 3.2" Diagonal, 262K Color TFT LCD, 400 x 240 Pixels

$8.45 - KAV00500FM-AFFY - Samsung Semiconductor - MCP - 2Gb OneNAND Flash + 1Gb Mobile SDRAM (Estimated)

$8.00 - MV8729CAB-G - MtekVision - Multimedia Processor - Dual ARM9™ Processors, Configurable Video Post-processing H/W Acceleration Blocks, Supports All Video Codecs at D1 Resolution

$5.50 - Touchscreen Overlay / Display Window - 3.2", 5-Wire Resistive, Film-to-Film, Black Painted, Silkscreened, w/ Flex PCB & PSA

$4.00 - SanDisk - MicroSD Memory Card - 1GB

$3.47 - DAP Corp. - 10-Layer - FR4/RCF HDI 2+6+2, Lead Free

$2.85 - AB563840CE - Battery - Li-Ion, 3.7V, 1000mAh

$2.82 - RTR6285 - Qualcomm - RF Transceiver - Single-Chip, ZIF, Quad-Band GSM/GPRS/EDGE, Tri-Band UMTS Transceiver, HSDPA, w/ Integrated GPS Receiver & Receive Diversity

Direct Materials Costs $142.87

Materials and Manufacturing$150.98

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

OEM/ODM/EMS Relationships / Manufacturing

According to iSuppli's Global OEM Manufacturing and Design Analysis - Mobile Handsets Q1 2009, Samsung's manufacturing profile is an all in-house operation with no production outsourced. Samsung, does, however benefit from a worldwide production footprint, and only about 30% of production capacity is in Korea. It is assumed though that the reason we see "Made in Korea" more often than not is because of the high-end nature of the devices we have been tearing down recently. It is therefore assumed that higher end units are mostly produced in Korea.

Country of Origin / Volume Assumptions

Based on label markings, the unit was assembled in Korea. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc). were sourced in China due to the low labor cost and Samsung's worldwide manufacturing footprint. Inn fact, Samsung, despite labeling such products as made in Korea, may in fact be doing several layers of integration (PCBA manufacturing, sub-assembly "kitting", etc.) in China, then finishing the device in Korea, as the country of final integration. In fact, over 50% of Samsung's total production capacity is in China, yet almost all products have the Made in Korea label that we see (possibly also because of a tendency to analyze higher end phones).

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of "finished" sub-assemblies (such as chargers), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Design for Manufacturing / Device Complexity

The Samsung Pixon M8800 has an overall component count of 922 (excluding box contents), of which, 102 are mechanical in nature - This is almost identical to the previously analyzed OMNIA SGH-i900.This component count is very modest considering the overall functionality of the phone. Due to ongoing silicon integration this phone is much simpler in these terms than far less functional PDAs analyzed 4 years ago with component counts that were 20 - 30% higher than found in this device.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Samsung Pixon (SGH-M8800) Mobile Phone - Main PCB Top (Cont.)Samsung Pixon (SGH-M8800) Mobile Phone - Main PCB Top (Cont.)
Design Notes

Qulacomm MSM6281 (just like Omnia SGH-i900) - The Pixon fesatures the same Qualcomm MSM6281 core baseband processor, and is essentially the same as the MSM6280 used in the LG Renoir (the "81" ending is for the US market). The MSM6281 features ARM926EJ-S microprocessor, dual QDSP4000 DSPs, and 225MHz ARM9 Jazelle Java hardware acceleration. The usual supporting chips from Qualcomm are also found in the design: PM6xxx for power management, and a single Qualcomm RTR6285 RF Transceiver that covers both WCDMA and UMTS frequencies in one device. Qualcomm chips offer a great deal of functionality typically including, in this case, integrated Bluetooth and GPS (though a discrete BT solution is also applied here).

MtekVision Multimedia Processor (MV8729CAB-G) AND a Fujitsu MBG027 Multimedia Co-Processor - This processor is a Dual ARM9 processor, with video post processing for "computationally intensive multimedia applications". The Fujitsu part was found in a recent analysis of a Sharp Japanese phone with OneSEG TV functionality.

Haptic feedback driver - Imagis ISA1000 - as mentioned before, Samsung is emplying the haptic feedback in other phones as well, and is a distinguishing feature. This chip is only part of the total haptic solution.

3-Axis Accelerometer - Bosch Sensortec - Ever since the iPhone, you can't have a feature phone without a MEMS-based 3-axis sensor, and auto orientation and this one has it too.

Other noteworthy major components include a Broadcom (BCM2046xxx) Bluetooth solution and a Silicon Labs FM radio tuner (both discrete).

Samsung Pixon (SGH-M8800) Mobile Phone - Display Module Exploded ViewSamsung Pixon (SGH-M8800) Mobile Phone - Display Module Exploded View

Here is a summary of the major components used in the Samsung Pixon 8800H design:

Main PCB

Baseband

  • Baseband - Qualcomm - MSM6281 - Baseband Processor - Single Chip, GSM/EDGE, WCDMA/HSDPA up to 7.2Mbps, w/ Integrated MDDI & Bluetooth 1.2 Baseband Processor

User Interface

  • Multimedia Processor - MtekVision - MV8729CAB-G - Dual ARM9™ Processors, Configurable Video Post-processing H/W Acceleration Blocks, Supports All Video Codecs at D1 Resolution
  • Bluetooth - Broadcom - BCM2046 - Single-Chip, V2.1+EDR, HCI Solution
  • FM Radio Tuner - Si4705 - Silicon Laboratories
  • Audio Codec - Texas Instruments - TLV320AIC3106IZQE - Stereo, w/ Stereo Headphone Amplifier, Low Power

Memory

  • Samsung Semiconductor - KAV00500FW - MCP - 2Gb OneNAND Flash + 1Gb Mobile SDRAM (Estimated)

Battery / Power Management

  • Qualcomm - PM6658 - Power Management IC - w/ Integrated USB Transceiver
  • Intersil - ISL9214IRZ - Battery Charger - Li-ion/Li-Polymer, 28V, 380mA

RF Transceiver - Power Amplifier

  • RF Transceiver - Qualcomm - RTR6285 - Quad-Band GSM/GPRS/EDGE, Tri-Band UMTS
  • PAM (GSM) - RF Micro Devices - RF3161 - Quad-Band, GSM850/EGSM900/DCS1800/PCS1900

Camera Module

  • Primary - 8.0MP CMOS, 1/3.2" Format, Auto Focus Lens
  • Secondary - CIF, CMOS, 1/11" Format, Fixed Lens

Display Module

  • 3.2" Diagonal, 262K Color TFT, 240 x 400 Pixels

Touchscreen

  • 5-Wire Resistive, Black Paint on Edge, w/ Flex PCB, Clear Lexan Polycarbonate Overlay


Samsung Pixon (SGH-M8800) Mobile Phone - Box ContentsSamsung Pixon (SGH-M8800) Mobile Phone - Box Contents



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement