Acquired Electronics360

Television Hardware

Sony KD30XS955 HDTV Teardown

30 November 2012
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

The scope of this analysis was not to perform a complete cost analysis on the entire Sony WEGA Television, but rather to focus on the main Analog and Digital A/V I/O and processing function boards within the television. Excluded from this analysis, are all of the power supply circuitry and tube drivers, as well as the tube itself and all enclosures, housings, etc.

Sony KD30XS955 HDTV - PA PCB Top - View ASony KD30XS955 HDTV - PA PCB Top - View A

The core electronics inside were far more "disintegrated" than we might have expected. For example, a recent DLP television analysis from Samsung featured only two main A/V processing boards divided neatly into analog and digital functionality. The Sony model was far more modular, witheach "feature", such as HDMI input, on it's own modular board. This approach probably makes sense for Sony, allowing them to add or take away features across a wide range or televisions but achieve relatively high re-use and possibly use similar or identical boards across multiple models.

Sony KD30XS955 HDTV - PA PCB Top - View BSony KD30XS955 HDTV - PA PCB Top - View B

The scope of our analysis was therefore limited to analyzing and costing the core electronics PCBAs. Below are an overview of the boards included in this analysis. The assembly names were derived from the two letter callouts as printed on the boards by Sony.

Summary of PCBAs Analyzed

BY PC Assembly

Core Digital Processing Board

The BY PC assembly is more mysterious in function to us than the other PC assemblies, because this board is almost exclusively populated with Sony chips whose individual functions were not all positively identified (except for the A/D and D/A converters which are commercial product. It is assumed that the other devices are digital ASICs specific to this television. Furthermore, it is assumed to be a core digital signal processing board.

MZ PC Assembly

General A/V Processing

This board interfaced on one side with the UZ PC Assembly - see below - this board is the main A/V I/O board with RCA/S-Video connections, etc.) and on the bottom with one of the large power supply boards (not included in this analysis).

PA Module Assembly

HDMI/DVI Interface/Receiver

The primary function of this module is defined primarily by the Silicon Image SiI9993CTG100 HDMI/ DVI Receiver.

Q Module Assembly

Digital & Analog Tuner & A/V Processing Board

Sony KD30XS955 HDTV - Q Module Assembly - Attached to AV Panel - View ASony KD30XS955 HDTV - Q Module Assembly - Attached to AV Panel - View A


Composed of the QM and QT PCBs (interconnected via board to board connection. The QT PCB served mainly as interconnect substrate for two rather high-end tuner modules. It appears that the QT Tuner Module B (whose functionality is defined by the ATI NXT2003 DTV Cable and Terrestrial Receiver) would be the digital tuner, and QT Tuner module A would likely be the analog tuner module.

The Q Module assembly serves not only a tuning function, but features (on the QM PCB) an ATI Xilleon 226 Multimedia Processor, one of the single beefiest and costliest chips in the set. In fact outside of this ATI chip on the QM PCB, memory chips are the only other significant components on this board.

Sony KD30XS955 HDTV - Q Module Assembly - Attached to AV Panel - View BSony KD30XS955 HDTV - Q Module Assembly - Attached to AV Panel - View B

UZ PC Assembly

Front-End

This board serves mainly as the A/V I/O interconnect board comprised primarily of RCA & S-Video jacks - however this board also features some front-end A/V processing (Sony Audio/Video Switch). This board interfaces on one side to the MZ PC Assembly.


Samsung Galaxy S III GT-i9300 Mobile Handset - Box ContentsSamsung Galaxy S III GT-i9300 Mobile Handset - Box Contents



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement