Acquired Electronics360

Mobile Devices

HTC XDAIII Mobile Phone Teardown

30 November 2012
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Main Features

PDA phone (slide out format with QWERTY keyboard) w/ quad band GSM/GPRS (there is a CDMA version for the Chinese market - China Unicom CU928 Pocket PC Phone), 3.5" TFT/LTPS screen with touchscreen, 400MHz processor, Wi-Fi (802.11b), Bluetooth, VGA Camera, SDIO slot, runs Windows Mobile 2003 for Pocket PC 2003 Second Edition.

HTC XDAIII Mobile Phone - Beauty ShotHTC XDAIII Mobile Phone - Beauty Shot
Marketing / positioning


Very high-end PDA phone - The XDA III is a derivative of HTC's "Blue Angel" line of PDA phones, and appears to be offered by several service providers and manufacturers under various other monikers (T-Mobile MDAIII, Siemens SX66). This device offers just about everything available and desirable in terms of wireless connectivity - , but perhaps, not so oddly does not offer 3G data transmission (EDGE). This device blurs the edge between PDA and phone - and largely leans, from a value perspective - more on the PDA side of the fence.

HTC XDAIII Mobile Phone - Rear Cover RemovedHTC XDAIII Mobile Phone - Rear Cover Removed

This device retails for anywhere from $450 (subsidized) to $900 (unsubsidized) and up - and represents the top end of the spectrum for most service provider's portfolios.

Cost Notes

The device is the most expense smart phone we have analyzed to date (roughly $243) with the largest component count (1485), most sophisticated PCB (10 layer with enormous I/O count), and largest on-board memory content seen to date - 128 Mbytes of Mobile RAM, Flash Disk-On-Chip - 512Mbit, an MCP (32Mbit NOR Flash and 4Mbit SRAM) and an EEPROM device.

HTC XDAIII Mobile Phone - Rear OpenHTC XDAIII Mobile Phone - Rear Open
But it doesn't stop there - this design is not highly integrated and has the largest semiconductor content ($115 worth across 75 integrated circuits, not to mention 63 discrete semiconductor devices) of any smart phone seen to date as well. The most notable of these devices include a 400Mhz Intel PXA263 Microprocessor, ATI IMAGEON 3200 Multimedia Co-Processor, and Bluetooth, 802.11b, DBB and ABB chips from Texas Instruments. Several HTC ASICs round out the major integrated circuits.

HTC XDAIII Mobile Phone - Main PCB Top DisassembledHTC XDAIII Mobile Phone - Main PCB Top Disassembled
The display is one of the largest in PDA phones and represents the largest single cost item (including the touchscreen) at roughly $50.

HTC XDAIII Mobile Phone - Dispay Housing DisassembledHTC XDAIII Mobile Phone - Dispay Housing Disassembled
Main Cost Drivers (Representing approximately 67% of total materials costs):

Display - 3.5 inch TFT/LTPS 65K Color / 240x320 w/Touchscreen ~$50

Memory Chips (combined) ~$51

Intel PXA263 400mHz Processor ~$13

GSM/GPRS Baseband Chips ~$10

802.11b / Bluetooth Chips ~$9

Battery (3.7V / 1450mAh / Li-Ion) ~$7

SD/MMD SDIO ASICs ~$7

Manufacturing Notes

  • Made in Taiwan - Based on the label we modeled manufacturing costs based on the assumption that the unit is not only end-assembled in Taiwan, but the PCB is also produced in Taiwan - with mechanical items (plastics and metals) produced in China.
  • Volume Assumptions - Although it does not have a major impact on our modeling costs - we have also assumed that approximately 200K units will be produced over the product's life.
  • 10% of total - Manufacturing costs on this device represent approximately 10% of total value - which is within norms for most handsets. This is because, despite the high level of complexity, and the high absolute cost of manufacturing, as a percentage of total given the elevated materials costs, appears normal.


HTC XDAIII Mobile Phone - Main PCB Bottom DisassembledHTC XDAIII Mobile Phone - Main PCB Bottom Disassembled



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