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Electronics and Semiconductors

Allegro MicroSystems, LLC Announces New Family of 2D Hall-effect Speed and Direction Sensor ICs

13 February 2018

Allegro MicroSystems, LLC has launched a new family of 2D Hall-effect Latch ICs that feature both vertical and Source: Allegro MicroSystems, LLC Source: Allegro MicroSystems, LLC planar Hall elements. The APS12625 and APS12626 sensor ICs enable reduced system size and bill-of-materials cost along with an increase in performance and flexibility due to 2D sensing. They were developed in accordance with ISO 26262 and qualified per AEC-Q100, making them suitable for automotive and other safety systems.

The APS12625 features speed and direction outputs whereas the APS12626 has quadrature (Channel A and B) outputs. A unique, optional feature allows the host system to restore the previous state of the sensor after a power-cycle. This reduces the potential accumulation of lost counts in intelligent motion applications such as window lifts with anti-pinch requirements.

Each IC contains a pair of sensor ICs that are orthogonal to one another and provide 90 degrees of phase separation between channels that is independent of magnet pole spacing and air gap. They are both available in each of three combinations of vertical and planar Hall elements (XY, ZX and ZY). Virtually any orientation between the sensor IC and the ring magnet can be accommodated, and the ring magnet pitch can be changed without losing quadrature.

These monolithic devices each include three Hall plates (one planar, two vertical), a multiplexer, a small-signal amplifier, chopper stabilization, a Schmitt trigger and two NMOS output transistors. They operate from 2.8 to 5.5 V and up to 175 degrees Celsius junction temperature. (See the device datasheet for details.) Each tiny SOT23-5 device replaces a pair of conventional Hall-effect latch ICs, meaning that redundant sensing for safety applications can be accomplished in virtually the same space as non-redundant implementations using legacy technology.

To contact the author of this article, email sue.himmelstein@ieeeglobalspec.com


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