Acquired Electronics360

Touch Panel

3D AR Will be the Core Technology Behind a New Mobile App

13 October 2017

Remark Holdings, Inc., announced that Sina Weibo is launching its first augmented-reality (AR) enabled mobile app named SuiShouPai. This translates to, “take a picture anywhere, anytime”. Remark Holdings implemented ShuiShouPai’s core AR feature using KanKan’s 3D facial-feature-tracking technology.

Sina Weibo SuiShouPai app (Sina Weibo)Sina Weibo SuiShouPai app (Sina Weibo)

But using KanKan’s AI technology, Sina Weibo is using advanced 3D facial-feature-tracking technologies to make mobile 3D AR possible. KanKan’s software was developed over the last few years using millions of globally-sourced facial feature samples. The software can recognize and track the movements of hundreds of facial features. Samples are available through SuiShouPai and they will enable KanKan’s facial recognition technologies to better understand facial expressions and improve AI’s underlying ability to learn human emotions based on facial features

Remark Holdings uses “deep learning” to train its artificial intelligence (AI) products. Using KanKan’s extensive data sets to train the KanKan AI Platform with tens of millions of supervised and unsupervised samples allows Remark Holdings to develop models that extract facial features and recognize objects like branded logos, animals or license plats with precision.

The KanKan AI Platform is designed to be a one-stop-shop that provides small and large enterprises and developers with the ability to customize and train the AI models for their businesses with stable AI modeling stacks and pre-trained models.

To learn more, visit the Remark Holdings site here.

To contact the author of this article, email Siobhan.Treacy@ieeeglobalspec.com


Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement