Toshiba America Electronic Components, Inc., has announced the release of two photocouplers for high-speed communications: the TLP2767 and TLP2367. The new photocouplers are housed in small, 2.3mm (max) low-height packages and meet various international safety standards, including UL1577 and EN60747-5-5. They are designed for applications like programmable logic controllers, I/O interface boards, photovoltaic inverters, and factory automation inverters.
The TLP2767 is the first 50Mbps photocoupler in the industry to provide a creepage and clearance distance of 8mm and isolation thickness of 0.4mm, supporting reinforced isolation. It features isolation voltage of 5000Vrms (min) and is houses in a SO6L package. The TLP2367 provides creepage and clearance distance of 5mm (min) and an isolation voltage of 3750Vrms. It is available in a 5-pin SO6 package. Both the TLP2767 and TLP2367 contribute to lowering the operation voltage of equipment with a supply voltage of 2.7V to 5.5V at temperatures up to 125˚C.
With a propagation delay time of 20ns (max), pulse with the distortion of 8ns (max), and propagation delay skew of ±10ns (max), the photocouplers can be used to reduce the dead time of various interfaces. These interfaces can improve the efficiency of equipment. On the input side, the TLP2767 and TLP2367 have Toshiba’s original high output infrared LEDs to reduce the threshold input current by approximately 20%, compared with existing Toshiba products. The output side, a photodetector IC fabrication with a CMOS process reduced the supply current y around 50%. This can lower power consumption and cost reduction of equipment.
Toshiba’s new photocouplers are now shipping. To learn more, visit the Toshiba site here.